Pre-Tinned (De-Golded) PCB Connectors

Picture for category Pre-Tinned (De-Golded) PCB Connectors

SV Microwave's new pre-tinned PCB connectors are available in our proven high-performance, high-density SMP and SMPM series. SV Microwave has developed a unique and proprietary method for removing gold in the solder area of our RF connectors. These connectors are designed to work with our automated de-golding process which mitigates undesirable remnants of gold plating in the solder joint.

Features / Benefits: 

  • Gold in soldered area removed per J-STD-001
  • Improves reliability of the solder joint
  • Connectors optimized for pre-tinning at the design stage
  • Cost savings compared to outsourcing or de-golding in house
  • Pre-tinning options available in both SN63 and SN96
  • Robust technical support for design, assembly and trouble-shooting
  • Footprint design optimization through simulation available

Applications:

  • Military and Aerospace Radar Transmit/Receive Units
  • Space and High Reliability Communications and GPS
  • Harsh Environment Applications (High Vibration, Extreme Temp.)
  • Any time de-golding is a concern or requirement

The specifications below are typical for the connector series, but may not apply to this particular part. Please see the datasheet for full specifications.

 

SMP

 

 Impedance (Ω)  50
 Frequency GHz  40 GHz
 Shielding Effectiveness  ≥ -80 dB DC - 3 GHz
 ≥ -65 dB 3 - 26.5 GHz
 Dielectric withstanding Voltage  500 VRMS
 Mating Cycles - SB   1000
 Mating Cycles - LD  500
 Mating Cycles - FD   100
 Insertion Force - SB  3.0 lbs
 Insertion Force - LD  5.0 lbs
 Insertion Force - FD   7.0 lbs
 Withdrawal Force - SB  0.5 lbs
 Withdrawal Force - LD  7.0 lbs
 Withdrawal Force - FD   9.0 lbs
 Axial Misalignment  .010” Max
 Radial Misalignment  3° Max
 Temperature Rating  -65°C to +165°C
 Corrosion (salt spray)  MIL-STD-202, Method 101, Condition B
 Vibration  MIL-STD-202, Method 204, Condition D
 Shock  MIL-STD-202, Method 213, Condition I
 Thermal Shock  MIL-STD-202, Method 107, Condition B
 Moisture Resistance  MIL-STD-202, Method 106, Less Step 7B
 Barometric Pressure (Altitude)  MIL-STD-202, Method 105, Condition C, 70k Ft.

 

 

SMPM

 

 Impedance (Ω)  50
 Frequency GHz  65 GHz
 Shielding Effectiveness  ≥ -80 dB DC - 3 GHz
 ≥ -65 dB 3 - 26.5 GHz
 Dielectric withstanding Voltage  325 VRMS
 Mating Cycles - SB   500
 Mating Cycles - FD   100
 Insertion Force - SB  2.5 lbs
 Insertion Force - FD   4.5 lbs
 Withdrawal Force - SB  1.5 lbs
 Withdrawal Force - FD   6.5 lbs
 Axial Misalignment  .010” Max
 Radial Misalignment  3° Max
 Temperature Rating  -65°C to +165°C
 Corrosion (salt spray)  MIL-STD-202, Method 101, Condition B
 Vibration  MIL-STD-202, Method 204, Condition D
 Shock  MIL-STD-202, Method 213, Condition I
 Thermal Shock  MIL-STD-202, Method 107, Condition B
 Moisture Resistance  MIL-STD-202, Method 106, Less Step 7B
 Barometric Pressure (Altitude)  MIL-STD-202, Method 105, Condition C, 70k Ft.

Application Note

Pre-tinned (De-golded) PCB Connectors Application Notes

Product Video

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