3mm Board-to-Board Interconnects

Picture for category 3mm Board-to-Board Interconnects

SV Microwave just launched our line of 3mm coaxial between board spacing PCB interconnects. This line allows for the lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system. SV’s 3mm product line is ideal for high density stacked and high density multiport applications. Additionally, installation of this line can be accomplished with and without solder.

Features / Benefits: 

  • 3mm board-to-board spacing
  • .150" minimum pitch between adjacent connectors
  • Direct pogo-pin style connection between PCBs
  • Lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system
  • DC - 40 GHz

Applications:

  • Embedded computing
  • High density stacked PCB applications
  • High density multiport applications

3mm

 Impedance (Ω)  50
 Frequency GHz  40 GHz
 Shielding Effectiveness  ≥ -80 dB DC - 3 GHz
 ≥ -65 dB 3 - 26.5 GHz
 Dielectric withstanding Voltage  500 VRMS
 Mating Cycles  500
 Insertion Force - SB  2.8 lbs
 Insertion Force - FD   3.4 lbs
 Withdrawal Force - SB  2.5 lbs
 Withdrawal Force - FD   3.0 lbs 
 Axial Misalignment  .005"
 Radial Misalignment  .007"
 Temperature Rating  -65°C to +165°C
 Corrosion (salt spray)  MIL-STD-202, Method 101, Condition B
 Vibration  MIL-STD-202, Method 204, Condition D
 Shock  MIL-STD-202, Method 213, Condition I
 Thermal Shock  MIL-STD-202, Method 107, Condition B
 Moisture Resistance  MIL-STD-202, Method 106, Less Step 7B
 Barometric Pressure (Altitude)  MIL-STD-202, Method 105, Condition C, 70k Ft.

Application Note

3mm Board to Board Application Notes

Product Video

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